top of page
ALUMINUM HONEYCOMB PANEL
TCB TOOLS
THERMAL COMPRESSION BONDING TOOLS
We provide precisely customized TCB bonding tools with high thermal conductivity AlN
Flatness - Top: 1.8㎛, Side B: 1.0㎛
Parallelization - Bottom: 1.7㎛, Side A: 1.0㎛
92 Euncheong-ro, Namdong-gu, Incheon City, South Korea, 21644
+82-032-225-0671 / +82-10-6602-6980
chase@rootsmaterials.com
© 2026 ROOTS CO., LTD. ALL RIGHTS RESERVED
bottom of page